S.M.A.R.T. Laboratory
Laser-Tech Diamond Wire Saw
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The system is used for low damage slicing of the semiconductor samples. The system can be programmed to automatically index and slice an ingot into wafers.

Laser-Tech Diamond Wire Saw
Laser-Tech Diamond Wire Saw

CdZnTe sample slicing with the the Laser-Tech diamond wire saw. The sample mount allows for various cutting angles.
CdZnTe sample slicing with the the Laser-Tech diamond wire saw. The sample mount allows for various cutting angles.

CdZnTe bars prepared for subsequent grinding, lapping, polishing, and etching.
CdZnTe bars prepared for subsequent grinding, lapping, polishing, and etching.



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Mechanical & Nuclear Engineering
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